Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | SpringerLink
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
Einladung zum virtuellen Stammtisch: KI-ready – Schritt für Schritt zur digitalisierten Produktion Kompetenzzentrum Usability
Applied Sciences | Free Full-Text | Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
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microTEC Südwest on Twitter: "Als nächster ist Peter Wappler von Hahn Schickard an der Reihe: „Sensorbasiertes Monitoring einer Spritzgussanlage“ Peter Wappler (Hahn-Schickard) #hahnschickard https://t.co/Me8OTAa9LR" / Twitter
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
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Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | SpringerLink
applied sciences
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | SpringerLink
Medizintechnik und Gesundheit, Produktion und Industrie 4.0 sowie neueste Technologietrends | WOTech Technical Media | WOMag | WOClean
9 Gründe für den Einsatz eines inline Düsen-Viskosimeters... - Innonet Kunststoff
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
JMMP | Free Full-Text | Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding - Document - Gale Academic OneFile
Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding - Document - Gale Academic OneFile